MOHAMAD RIDUWAN RAMLI

@usm.my

University Lecturer, School of Materials and Mineral Resources Engineering
Universiti Sains Malaysia

MOHAMAD RIDUWAN RAMLI


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https://researchid.co/riduwan

RESEARCH, TEACHING, or OTHER INTERESTS

Polymers and Plastics, Electronic, Optical and Magnetic Materials, Chemistry, General Engineering
494

Scholar Citations

11

Scholar h-index

14

Scholar i10-index

RECENT SCHOLAR PUBLICATIONS

  • Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging
    MAF Muhamed Mukhtar, JX Phang, NR Abd Khalid, MK Abdullah, ...
    Soldering & Surface Mount Technology 38 (3), 205-215 , 2026
    2026
  • Advances in Self-Healing Ordinary Portland and Geopolymer Cement Systems: A Comprehensive Review of Stimuli-Responsive Polymer Mechanisms and Performance
    AS Abbas, KA Shariffa, MR Ramli, AHM Mohammed
    Journal of Advanced Concrete Technology 24 (4), 191-204 , 2026
    2026
  • Investigation of Thermal Aging, Accelerated Weathering, and Durability of Self‐Healing Natural Rubber Reinforced Multi‐Walled Carbon Nanotube (MWCNT) Composites
    SAZ Rashid, NA Zainuddin, N Hayeemasae, MR Ramli, RK Shuib
    Polymer Engineering & Science 65 (9), 4791-4799 , 2025
    2025
    Citations: 2
  • Thermal Characteristics Dependency of Epoxy Underfill on Crosslinker Molecular Structures and Hardener Concentration in Electronic Packaging
    NR Abd Khalid, MK Abdullah, MA Bakar, SMM Syed Mohamed Zain, ...
    Journal of Electronic Packaging 147 (3), 031008 , 2025
    2025
    Citations: 1
  • Integrated optimization of process parameters and gate design in plastic injection moulding of A-pillar parts using simulation and neural network approaches
    MR Ramli, W Jia Yi, AA Mohamad, RK Shuib, F Muhammad Nasir, ...
    Progress in Rubber, Plastics and Recycling Technology, 14777606261422749 , 2025
    2025
  • Investigation of the impacts of solder alloy composition and temperature profile on fatigue life of ball grid array solder joints under accelerated thermal cycling
    RK Apalowo, MA Abas, MAFM Mukhtar, MR Ramli
    Journal of Electronic Packaging 147 (1), 011005 , 2025
    2025
    Citations: 11
  • Stereometric analysis of underfilled micro ball grid array solder joints under thermal cycling conditions
    MF Suhaimi, MA Bakar, A Jalar, AA Ismail, MN Ilias, MR Ramli, FC Ani, ...
    J. Kejuruteraan 37 (3), 1387-1396 , 2025
    2025
    Citations: 2
  • Investigating the Effects of Mechanical Strain on the Performance of Stretchable Microstrip Slot Antenna at mmWave
    MI Jamaluddin, ISZ Abidin, A Abd Aziz, MR Ramli
    2024 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), 389-392 , 2024
    2024
    Citations: 2
  • Additive Manufacturing of Polylactic Acid for Electrostatic Discharge Materials Application
    IFB Ismail, RKB Shuib, MRB Ramli, SK Chia
    Journal of Physics: Conference Series 2907 (1), 012024 , 2024
    2024
  • Solder paste stencil with aperture wall coating
    FBC Ani, MRB Ramli, MSBM Sunar, IB Ahmad
    US Patent 12,069,810 , 2024
    2024
    Citations: 1
  • Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test
    RK Apalowo, MA Abas, F Che Ani, MAF Muhamed Mukhtar, MR Ramli
    Soldering & Surface Mount Technology 36 (3), 154-164 , 2024
    2024
    Citations: 20
  • Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
    RK Apalowo, MA Abas, Z Bachok, MFM Sharif, F Che Ani, MR Ramli, ...
    Microelectronics International 41 (3), 162-171 , 2024
    2024
    Citations: 6
  • Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
    RK Apalowo, MA Abas, MAF Muhamed Mukhtar, F Che Ani, MR Ramli
    Soldering & Surface Mount Technology 36 (2), 101-110 , 2024
    2024
    Citations: 13
  • Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process
    Z Bachok, A Abas, HAL Raja Gobal, N Yusoff, MR Ramli, MF Mohd Sharif, ...
    Soldering & Surface Mount Technology 35 (5), 305-318 , 2023
    2023
    Citations: 3
  • Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
    RK Apalowo, A Abas, Z Bachok, MFM Sharif, FC Ani, MR Ramli, ...
    Microelectronics Reliability 146, 115028 , 2023
    2023
    Citations: 15
  • Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process
    FC Ng, A Abas, MR Ramli, MF Mohd Sharif, F Che Ani
    Soldering & Surface Mount Technology 35 (3), 166-174 , 2023
    2023
    Citations: 5
  • Effect of alloy particle size and stencil aperture shape on solder printing quality
    MS Mohamed Sunar, M Abu Bakar, A Jalar, MR Ramli, F Che Ani
    Microelectronics International 39 (2), 81-90 , 2022
    2022
    Citations: 9
  • Thermal cycling effect on the crack formation of solder joint in ball grid array package
    MF Suhaimi, M Abu Bakar, A Jalar, F Che Ani, MR Ramli
    Journal of Physics: Conference Series 2169 (1), 012006 , 2022
    2022
    Citations: 11
  • Effect of stencil wall aperture on solder paste release via stencil printing
    MS Mohamed Sunar, M Abu Bakar, A Jalar, F Che Ani, MR Ramli
    Journal of Physics: Conference Series 2169 (1), 012037 , 2022
    2022
    Citations: 4
  • Horizontal Crack Induces Vertical Crack For-mation in Epoxy Mold Compound for Electronic Packaging
    SMMSM Zain, A Jalar, MA Bakar, FC Ani, MR Ramli
    Informacije MIDEM 51 (4), 261-266 , 2021
    2021

MOST CITED SCHOLAR PUBLICATIONS

  • Dielectric constant and refractive index of poly (siloxane–imide) block copolymer
    MBH Othman, MR Ramli, LY Tyng, Z Ahmad, HM Akil
    Materials & Design 32 (6), 3173-3182 , 2011
    2011
    Citations: 88
  • Cross-link network of polydimethylsiloxane via addition and condensation (RTV) mechanisms. Part I: Synthesis and thermal properties
    MR Ramli, MBH Othman, A Arifin, Z Ahmad
    Polymer degradation and stability 96 (12), 2064-2070 , 2011
    2011
    Citations: 62
  • Stretchable conductive ink based on polysiloxane–silver composite and its application as a frequency reconfigurable patch antenna for wearable electronics
    MR Ramli, S Ibrahim, Z Ahmad, ISZ Abidin, MF Ain
    ACS applied materials & interfaces 11 (31), 28033-28042 , 2019
    2019
    Citations: 59
  • Effect of crosslink density on the refractive index of a polysiloxane network based on 2, 4, 6, 8‐tetramethyl‐2, 4, 6, 8‐tetravinylcyclotetrasiloxane
    LY Tyng, MR Ramli, MBH Othman, R Ramli, ZAM Ishak, Z Ahmad
    Polymer international 62 (3), 382-389 , 2013
    2013
    Citations: 53
  • Alignment of silver nanoparticles in polysiloxane crosslink network under direct electric field
    MS Masraff, AMNAA Rahman, MR Ramli, MKM Jamil, MK Abdullah, ...
    Composites Science and Technology 203, 108611 , 2021
    2021
    Citations: 27
  • Effect of cross-link density on optoelectronic properties of thermally cured 1, 2-epoxy-5-hexene incorporated polysiloxane
    SN Yahya, CK Lin, MR Ramli, M Jaafar, Z Ahmad
    Materials & Design 47, 416-423 , 2013
    2013
    Citations: 25
  • Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test
    RK Apalowo, MA Abas, F Che Ani, MAF Muhamed Mukhtar, MR Ramli
    Soldering & Surface Mount Technology 36 (3), 154-164 , 2024
    2024
    Citations: 20
  • Crosslink network and phenyl content on the optical, hardness, and thermal aging of PDMS LED encapsulant
    M Lay, MR Ramli, R Ramli, NC Mang, Z Ahmad
    Journal of Applied Polymer Science 136 (34), 47895 , 2019
    2019
    Citations: 18
  • Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
    RK Apalowo, A Abas, Z Bachok, MFM Sharif, FC Ani, MR Ramli, ...
    Microelectronics Reliability 146, 115028 , 2023
    2023
    Citations: 15
  • Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints
    RK Apalowo, MA Abas, MAF Muhamed Mukhtar, F Che Ani, MR Ramli
    Soldering & Surface Mount Technology 36 (2), 101-110 , 2024
    2024
    Citations: 13
  • Investigation of the impacts of solder alloy composition and temperature profile on fatigue life of ball grid array solder joints under accelerated thermal cycling
    RK Apalowo, MA Abas, MAFM Mukhtar, MR Ramli
    Journal of Electronic Packaging 147 (1), 011005 , 2025
    2025
    Citations: 11
  • Thermal cycling effect on the crack formation of solder joint in ball grid array package
    MF Suhaimi, M Abu Bakar, A Jalar, F Che Ani, MR Ramli
    Journal of Physics: Conference Series 2169 (1), 012006 , 2022
    2022
    Citations: 11
  • Synthesis of carbazole‐substituted poly (dimethylsiloxane) and its improved refractive index
    NH Nordin, MR Ramli, N Othman, Z Ahmad
    Journal of Applied Polymer Science 132 (11) , 2015
    2015
    Citations: 11
  • Effect of moisture content on crack formation during reflow soldering of ball grid array (BGA) component
    SMMSM Zain, FC Ani, MR Ramli, A Jalar, MA Bakar
    International Conference on Innovative Technology, Engineering and Science … , 2020
    2020
    Citations: 10
  • Effect of alloy particle size and stencil aperture shape on solder printing quality
    MS Mohamed Sunar, M Abu Bakar, A Jalar, MR Ramli, F Che Ani
    Microelectronics International 39 (2), 81-90 , 2022
    2022
    Citations: 9
  • Surface roughness effect on optical loss in waveguide using isotropically induced crosslink network of siloxane–polyimide copolymer
    NF Mohd Ibrahim, MR Ramli, A Rusli, MK Abd Rahman, Z Ahmad
    Journal of Applied Polymer Science 137 (47), 49554 , 2020
    2020
    Citations: 9
  • Synthesis of siloxane-polyimide copolymer with low birefringence and low loss for optical waveguide
    N Ibrahim, M Riduwan, A Rusli
    J. Phys. Sci 30, 103-113 , 2019
    2019
    Citations: 7
  • Interphase volume calculation of polyimide/TiO 2 nanofibers nanocomposite based on dielectric constant model and its effect on glass transition
    M Lay, S Meng, MR Ramli, Z Ahmad, H Ismail, TS Huat, M Todo
    Journal of Materials Science: Materials in Electronics 29 (24), 20742-20749 , 2018
    2018
    Citations: 7
  • Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation
    RK Apalowo, MA Abas, Z Bachok, MFM Sharif, F Che Ani, MR Ramli, ...
    Microelectronics International 41 (3), 162-171 , 2024
    2024
    Citations: 6
  • Effect of potting encapsulation on crack formation and propagation in electronic package
    A Jalar, SMMSM Zain, FC Ani, MR Ramli, MA Bakar
    International Conference on Innovative Technology, Engineering and Science … , 2020
    2020
    Citations: 6